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X-eye 6100

  • High speed 2D In-Line Inspection System (0.5 sec/FOV)
  • BGA, Chip, QFN, QFP, Battery
  • Short, Bridging, Manhattan, Miss align, etc

     In-Line 2D X-ray Inspection Machine
    Automatically In-Line inspect Solder Joint defects of PCBA, and other defects on Hidden Components.
    Able to be customized regarding Application by users setting ROIs.
    Especially, area type image scanning can gain high resolution results fast.

Description

About the X-eye 6100

Specifications
Min. Resolution 5㎛
Table Size 400 X 400 mm
AXIS n/a
Detector 5 inch FPXD
CT Scan Method Unable CT
Objects BGA, Chip, QFN, QFP, Battery
Foot print 1,020 x 1,350 x 1,720 mm
Weight 1,500kg
SMT Chip BGA (Short, Miss align, Missing)
Battery Inspection

    X-eye 6100 Quick contact

      Red star = required