Ready To Use Understencil Wipe – KYZEN E5631J
- Category: Stencil Cleaning Agents & Chemistries
- Manufacturer: Kyzen
On Printer Understencil Wipe Cleaning
- Improves Solder Paste Release from Even the Smallest of Apertures
- Does Not Interact or Remove Nano Coatings
- Low Cost of Ownership
- Compatible with Wetted Components in Automatic Stencil Printers
About the Ready To Use Understencil Wipe – KYZEN E5631J
A ready-to-use solution for removing raw solder paste from stencils both in online and offline stencil cleaning processes. E5631J is a cost-effective solution that quickly and efficiently cleans all types of raw solder pastes to make every print count. KYZEN E5631J is proven compatible with common stencils, cleaning equipment, and printer manufacturers. It is formulated with the worker and environment in mind.
Product Data
- Process: Online & Offline Stencil Cleaner
- Concentration: Ready to Use
- Temperature: Ambient to 120°F/49°C
- Rinse: DI Water/Solvent
- Dry: Warm Air Recommended
- pH (10g/L): N/A (Solvent-Based)
- Flash Point: None to Boiling
- Boiling Point: 212°F / 100°C
- Water Soluble: Complete
- VOC, @ 100% 131 g/L