Semi-Automatic PCB Rework Station – Summit 750i
- Category: PCB Rework Stations
- Manufacturer: VJ Electronix
Turn-Key PCB Rework System. Nozzles Included
The cost-effective and high performance solution to your PCB rework needs. The Summit 750i is capable of handling boards up to 18″x22” and components as small as 0201.
- Maximum PCB Size: 455x560mm
- Maximum Field of View: 50mm
About the Semi-Automatic PCB Rework Station – Summit 750i
Built with easy-to-use 1-2-3-GO software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a repeatable rework process. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE systems.
"1-2-3-Go" Graphical User Interface - Proprietary SierraMate™ Windows® based software provides an easy to use “1-2-3-Go” graphical user interface increasing user friendliness.
Efficient Convection Heating - Closed-loop temperature control ensures a more even heat distribution as compared to IR heating.
Comprehensive Tooling - Wide range of tooling available to meet your current and future rework needs.
Industry 4.0 Compliant - Automated data/event logging directly to your EMS. Enhanced profile sharing and user collaboration.
Auto Profiling Capability - Fast and easy profile creation. Simply enter the desired product temperatures. After thermal profile is created, the entire reflow process is built automatically and ready to run.
Independent Pick and Place - Motorized reflow head driven by an advanced motion system with programmable force control provides precision with total flexibility.
Digital Split Imaging - Digital split imaging allows up to four corners (and its pads) of a large component to be viewed under high magnification.
Easy-To-Use Auto Profiling Software
- User-friendly, simple thermal profile development
- Default reflow profiles for standard rework processes
- Advanced profile analysis software confirms successful profile development
- Automatic reflow, remove, and replace profile created after development of Auto Profile Simple Component-to-Site Alignment
Simple Component-to-Site Alignment
- Two-color LED optical alignment system allows for easy-to-see component to site alignment
- Movable X-Y table with micrometer fine adjust for precise alignment Repeatable Thermal Performance
Repeatable Thermal Performance
- Efficient Convection Heaters provide high thermal uniformity
- Board conditioning (preheat) is temperature based via thermocouples allowing for precise temperature measurements
MES Interface
- Track all operations performed on rework system from automatic event log
- Reflow processes easily transferred between systems
Available Tooling for Any Surface Mount Component
- Standard nozzles for conventional components
- Special nozzles for unique components
Specifications
- Placement Capability: 0.0020” (50u) mean + 3σ
- Maximum Board Size: 455 x 560mm (18 x 22”)
- Minimum Component Size: 0201
- Maximum Field of View: 50mm (2.0”) Square
- Thermocouple Jacks: 6 (16 optional)
- Theta Motion: 360°
- Top Heater: 1600W
- Area Heater: 4000W
- Site Heater (option): 1000W