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Quadra™ W8

Wafer X-ray Inspection

Quadra W8 is a versatile, lab based solution for wafer level inspection offering industry leading magnification and image quality.

  • Check shape, fill level and voiding in TSV through silicon vias.
  • Inspect build quality, wire bonds, component alignment and solder & adhesive voiding during MEMS manufacture.
  • Check for bump presence, shape, position and voiding in wafer bumps.
  • Find defects such as cold joints, head in pillow and misalignment in 2.5D and 3D wafer level packages.

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Integrated wafer handling ensures operators can inspect wafer level quality directly from the FOUP without needing to handle the wafer.

Description

About the Quadra™ W8

See the finest details Quadra™ W8 creates unbeatable images making it easy to see even the tiniest details and find defects quickly.
  • Integrated image chain reveals defects as small as 0.1µm. Tube, power supply and detector are all designed and manufactured in house for electronics applications
  • Advanced enhancement filters bring out the sharpest images
  • Unbeatable resolution with the Aspire 6.7 MP detector
Simplicity as standard X-ray inspection should be as easy and intuitive to use as possible. Quadra W8 allows occasional users and experienced operators to see incredible X-ray images quickly, easily and with minimal training.
  • Minimize operator training with intuitive Gensys software
  • Automate image acquisition with AIR routines
  • Find defects fast with mouse point and click control
Automated wafer handling Inspect wafers straight from the FOUP. Quadra™ W8 ensures maximum wafer integrity by removing any operator manual wafer handling.
  • EFEM handling ensures complete wafer protection
  • SECS/GEM factory host integration for tracking and control
  • SEMI S2, S8 compliant

    Quadra™ W8 Quick contact

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