Next Generation PCB Stencil Cleaner – KYZEN E5631
- Category: Stencil Cleaning Agents & Chemistries
- Manufacturer: Kyzen
Next Generation Stencil Cleaner
A cost-effective solution formulated to clean flux and uncured adhesives from stencils and misprints. Designed to be a total stencil cleaning solution, it is diluted and used in all stencil cleaning processes including spray-in-air and ultrasonic processes as well as in the printer as an understencil wipe solution.
- Works Great at Low Concentrations
- Approved for Understencil Wipe Systems
- Effective for A-Side Misprints
- Low Cost of Ownership
- Favorable GHS and Safety Ratings
About the Next Generation PCB Stencil Cleaner – KYZEN E5631
KYZEN E5631 is designed to be used at low concentrations and ambient temperature in stencil cleaning processes including spray-in-air, understencil, and ultrasonic systems. E5631 was formulated with the worker and environment in mind and is a cost-effective solution that quickly and efficiently cleans all types of raw solder paste flux from stencils and A-side misprints.
KYZEN E5631 has proven compatible with stencil foil, epoxy adhesives, frames, and mesh as well as the materials of construction found in stencil cleaning equipment. E5631 has favorable GHS and safety ratings. KYZEN E5631 is a non-hazardous, biodegradable aqueous solution that is RoHS compliant and meets all REACH requirements to date.
Product Data
- Application: Stencil Cleaner
- Process: Spray-in-Air & Ultrasonics
- Concentration: <25%
- Temperature: Ambient to 120°F/49°C
- Rinse: Recommended DI Water
- Dry: Hot Air
- pH (10g/L): N/A (Solvent-Based)
- Flash Point: None to Boiling
- Boiling Point: 220°F / 104°C
- Water Soluble: Complete up to 15%
- VOC, @ 10% 87.4 g/L
Steps When Cleaning with an Ultrasonic Immersion System with Water Rinse Cleaning Process
- STEP 1: KYZEN E5631 cleans solder paste from stencil apertures in ultrasonic cleaning tanks using an operating concentration range for water-soluble soils at 5-10%, and 10-25% for rosin-based and No-Clean soils. The product does not phase separately and requires no mixing before or during use.
- STEP 2: KYZEN E5631 rapidly dissolves the flux composition for all solder paste types including water-soluble, rosin and no-clean.
- STEP 3: The maximum wash cycle time is typically less than 4 minutes.
- STEP 4: KYZEN E5631 easily rinses with water, leaving no residue on stencil surfaces.