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Inline AOI EQUIPMENT : MV-6e 2D/3D

The World’s Best Performance 3D AOI

  • FIVE CAMERA In-Line AOI System
  • Exclusive TEN MEGA PIXEL ISIS® Vision System
  • 9.8 Micron / Precision TELECENTRIC COMPOUND LENS
  • Integrated INTELLI-SCAN® 3D Laser Inspection System
  • Superior Lifted Lead Detection for Gull Wing Devices
  • Height Measurement for Inspection of BGA and CSP Devices
  • Integrated Ten Mega Pixel SIDE-VIEWER® Camera System
  • Precision AC Servo Drive Motor System
  • Extremely Simple Programming and Operation

Description

About the Inline AOI EQUIPMENT : MV-6e 2D/3D

The award-winning MV-6e OMNI 3D AOI machines are configured with the exclusive OMNI-VISION 3D inspection system that combines 15 megapixel CoaXPress camera technology with MIRTEC’s revolutionary Digital Multi-Frequency Quad Moiré 3D system to provide precision inspection of SMT devices on finished PCB assemblies. The proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as 3D solder fillet inspection post reflow.

Fully configured, the MV-6e OMNI machine features four (4) 18 megapixel side-view cameras in addition to the 15 megapixel CoaXPress Top-Down camera and an eight (8) phase color lighting system.

The MV-6e In-Line AOI machine is configured with the 18/10 megapixel inspection technology, which combines an exclusive 8 phase coaxial color lighting system with the revolutionary Intelli-Scan Laser 3D Inspection system. The MV-6e machine also features four 18 megapixel side-view cameras.

MIRTEC’s exclusive 18 megapixel camera features the highest speed inspection among the 2D AOI system, even though it is configured with 7.3㎛ super precision lens to inspect up to 0201(mm) sized chips. The coaxial light is one of the best inspection solutions for reflective materials such as CSPs (chip scale packages), while its Intelli-Scan 3D Laser scanner provides an ability to find defects on lifted IC leads easily.

FEATURES SUMMARY:

  • Exclusive10MP/18MPCameraTechnology
  • Precision Telecentric Compound Lens Design
  • Eight Phase Color Lighting System
  • 10MP / 18MP SIDE-VIEWER® Camera System
  • Extremely Simple Programming and Operation
  • Integrated INTELLI-SCAN® Laser Inspection System
  • 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP Devices
  • Enhanced 3D Solder Paste Height Measurement Capability
  • INTELLISYS® Industry 4.0 Intelligent Factory Inline 3D AOI Equipment

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