Fully Automatic PCB Rework Station – Summit 2200i
- Category: PCB Rework Stations
- Manufacturer: VJ Electronix
High Precision, Fully-Automatic System For Medium-Sized SMD Assemblies
The minimal operator intervention rework system. The Summit 2200i is capable of handling boards up to 22″x30” and components as small as 01005.
- Maximum Board Size: 455x560mm (560x760mm optional)
- Maximum Field of View: 65mm (80mm optional)
About the Fully Automatic PCB Rework Station – Summit 2200i
Built with easy-to-use 1-2-3-GO software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a repeatable rework process. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE systems.
Dual Heads - Dual Rework and Scavenger heads provide the capability to perform complete rework in a single thermal cycle.
Fully Programmable - Full user control of all programmable features. Key features include:
- Motorized top heater travel
- Motorized component pick-up tube
- Zero force component removal
- Component height sensing
- Component alignment view height
- Component pick from nest
- Positioning of shuttle, part nest, and vision optics
Efficient Convection Heating - Closed-loop temperature control ensures a more even heat distribution as compared to IR heating.
Comprehensive Tooling - Wide range of tooling available to meet your current and future rework needs.
Industry 4.0 Compliant - Automated data/event logging directly to your EMS. Enhanced profile sharing and user collaboration.
Auto Profiling Capability - Fast and easy profile creation. Simply enter the desired product temperatures. After thermal profile is created, the entire reflow process is built automatically and ready to run.
Multi-Sequence Run - Ability to perform removal, scavenge, replace, and reflow on multiple components in a single cycle without any operator intervention.
Easy-To-Use Auto Profiling Software
- User-friendly, simple thermal profile development
- Default reflow profiles for standard rework processes
- Advanced profile analysis software confirms successful profile development
- Automatic reflow, remove, and replace profile created after development of Auto Profile Simple Component-to-Site Alignment
Simple Component-to-Site Alignment
- Two-color LED optical alignment system allows for easy-to-see component to site alignment
- Motorized and programmable X, Y, Z, and theta axis allows for fully automated rework
- Automatic alignment through AI technology allows for alignment of components with no operator intervention required. Software automatically detects corners of component and site using fiducials, from this the pick locations (centerpoint) is determined automatically.
Repeatable Thermal Performance
- Efficient Convection Heaters provide high thermal uniformity
- Board conditioning (preheat) is temperature based via thermocouples allowing for precise temperature measurements
Automatic Non-Contact Site Scavenging
- Dynamic Height Sensing (DHS) Scavenger maintains consistent scavenger tip to board gap safely removing residual solder
- Programmable X,Y, and Z axis eliminates operator intervention
- Nitrogen capability for consistent results without post scavenge cleaning
MES Interface
- Track all operations performed on rework system from automatic event log
- Reflow processes easily transferred between systems
Available Tooling for Any Surface Mount Component
- Standard nozzles for conventional components
- Special nozzles for unique components
Specifications
- Placement Capability: 0.0005” (12u) mean + 3σ
- Maximum Board Size: 455 x 560mm (560 x 760mm optional)
- Minimum Component Size: 01005
- Maximum Field of View: 65mm Square (80mm square optional)
- Thermocouple Jacks: 6 (16 optional)
- Theta Motion: 360°
- Top Heater: 1600W
- Area Heater: 4000W (7800W optional)
- Site Heater (optional): 1000W