Flip Chip Bonder
- Category: Semiconductor Packaging Equipment
- Manufacturer: SEC
| Dimension |
FCB-200 : 2,680(W) x 1,440(D) x 1,850(H)mm FCB-300 : 2,894(W) x 1,624(D) x 1,840(H)mm |
|---|---|
| Accuracy |
FCB-200 : 2.0 µm (3σ) FCB-300 : 1.5 µm (3σ) |
| Cycle Time |
FCB-200 : 1.7sec / IC FCB-300 : 1.3sec / IC |
| Temperature |
FCB-200 : 30~550°C FCB-300 : 30~550°C |
| Bonding Force |
FCB-200 : 10~343N FCB-300 : 10~343N |
| Wafer Size |
FCB-200 : Φ6 inch (Φ150 mm) Φ8 inch (Φ200 mm) FCB-300 : Φ8 inch (Φ200 mm) Φ12 inch (Φ300 mm) |
About the Flip Chip Bonder
- •High-speed, high-precise Linear Motor
- Optimized Vision Image UI
- Auto light Controller installed
- Easy maintenance by localization of main parts
- FPC supply method : Reel or Magazine
- Dispensing function available