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FINEPLACER® femto 2

Advanced Automatic Sub-Micron Bonder

The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.3 µm @ 3 sigma that offers unrivaled flexibility for prototyping & production environments.

A complete machine enclosure allows very demanding applications in a controlled environment. Fully protected from external influences, this automatic flip chip bonder stands for highly stable assembly processes with the focus on maximum yield.

The new generation of the femto automated die bonding platform adds numerous innovations to the proven technical basis. This includes the cutting-edge FPXvisionTM. Combined with a refined pattern recognition, this all-new Vision Alignment System opens up a new dimension of application flexibility and accuracy. IPM Command, the fully revamped FINEPLACER® operating software, supports a consistent, ergonomic and clearly structured process development.

Depending on the requirements, the modular design of the automated die bonder FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies. This makes this automatic flip chip bonder a perfect tool and reliable companion as applications migrate from product development to production. This automated bonding system covers the entire workflow of inspection, characterization, packaging, final test and qualification in semiconductor, communications, medical and sensor technologies.

Description

About the FINEPLACER® femto 2

"The FINEPLACER® femto 2 has enabled our company to realize higher throughput automation of our high accuracy flip chip bonding operations. As our high reliability opto-electronic transceiver business is expanding, this has helped us to satisfy our customer’s growing needs."
Howard Lenos Ultra Communications, Inc.

Key Facts*

 
 
  • Placement accuracy of 0.3 µm @ 3 Sigma on small to large substrates
  • Automatic placement accuracy calibration
  • Wide range of controlled bonding forces
  • UHD vision alignment system with FPXvisionTM
  • Multi-chip capability
  • Safe and controlled process environment with cleanroom quality
  • Wide range of component presentation (wafer, waffle pack, gel-pak®)
  • Modular machine platform allows in-field retrofitting during entire service life
  • Large bonding area
  • Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
  • Ultra low bonding force
  • Individual configurations with process modules
  • Various bonding technologies in one recipe
  • Integrated scrubbing function
  • Process module compatibility across Finetech platforms
  • Wide range of supported component sizes
  • Synchronized control of all process related parameters
  • Process and material traceability via TCP (for MES)
  • Full process access & easy visual programming with touch screen interface
  • Data/media logging and reporting function
  • 3-color LED illumination
  • In-situ process observation in HD
  • Fully automatic and manual operation
  • Automatic tool management
*depending on the selected configuration
 

Applications & Technologies

With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.Generic MEMS assemblyGas pressure sensor assemblyHigh-power laser module assemblyMicro-optical bench assemblyUltrasonic transceiver assemblyIR detector assemblyLaser diode assemblyVisual image sensor assemblyAcceleration sensor assemblyVCSEL/photo diode (array) assemblyMechanical assemblyX-ray detector assemblyLaser diode bar assemblyGeneric MOEMS assemblySingle photon detector assemblyOptical sub assembly (TOSA/ROSA)Micro optics assemblyLens (array) assemblyInk jet print head assemblyE-beam module assembly
Chip on Flex/Film (CoF)Chip on Glass (CoG)Multi chip packaging (MCM, MCP)Flip chip bonding (face down)2.5D and 3D IC packaging (stacking)Wafer level packaging (FOWLP, W2W, C2W)Precision die bonding (face up)Flex on boardChip on board (CoB)

Functions - Modules - Enhancements

Our die bonding solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient. 

Videos

 
 

FINEPLACER® femto 2 - High Accuracy Automatic Die Bonder

The FINEPLACER® femto 2 bonder offers a precise large working stage, large device 3D handling, extended FOV, ultra HD vision system, and multicolor illumination. System features include a process gas enclosure, low and high bond force, and a local cleanroom environment.
 

FINEPLACER® femto 2 - Die Flipping Unit

Integrated die flip module automatically flips chips of various sizes and thickness. Can be used for chips that are presented with the bond side facing upward. Interchangeable platforms of the unit allow for component-specific adaptation.

Technical Paper

 

Laser Bar Bonding

Semiconductor Laser diode bars are high power products, used in places where small and efficient emitting light sources are needed. Primarily, these Lasers are being used as pumping sources for optical resonators of solid state Lasers or gas Lasers.
 
 

VCSEL Bonding

The packaging of opto-electronic units is one of the key applications of Micro Assembly. Highly dense packaged multiplex transmitters, receivers and combined assemblies are...
 
 

Eutectic Bonding with Au/Sn

Eutectic Gold/Tin (Au/Sn) is a hard solder alloy often used to bond demanding microelectronic and optoelectronic devices. They are available in different forms, such as pre-forms, solder paste or ribbons.

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