Die Bonders, Flip Chip Bonders & Rework Equipment

FINEPLACER® pico ma is a true laboratory die bonder with the virtues of a production system. A virtually unlimited range of functions, highly stable processes and up to 3 µm placement accuracy make the die bonder a cost-performance-leader.

Finetech’s high-precision placement and assembly systems support customers from the photonics and optoelectronics industry in cost-efficient product development and transfer to automated manufacturing.

FINEPLACER® femto 2 features a placement accuracy of up to ± 0.5 µm @ 3 Sigma and supports a wide range of assembly applications at chip and wafer level.