3D AOI/SPI | JUKI RV-2-3DH/RV-2-3
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- Manufacturer:
The new outstanding high-speed and high-precision board inspection RV-2-3DH is equipped with a new 12 Megapixel camera achieving the highest throughput. It has an inspection capability of 0.4×0.2mm size SMDs with its new standard resolution lens of 12µm. And the following features:
- Extended board size capability with the new RV-2-3DHL model.
- A new high-resolution 5 µm lens is available with the capability to inspect 0.2X0.1mm size SMDs.
- Ready-to-use templates to set-up new parts
- Flexible programming using the “Process Mode” function for mechanical measurements.
- All-in-one S/W. No third-party CAD/Gerber converter software is needed.
- AOI and SPI configurations available in one single machine.
About the 3D AOI/SPI | JUKI RV-2-3DH/RV-2-3
- Overwhelming inspection speed Large improvement in inspection tact with high-pixel (12 million pixels)
- Remarkable inspection accuracy Using high-resolution lenses improves inspection accuracy of ultra-compact components
- Ease of use of rating Process modes that are easy to use and create,from beginners to senior citizens
- Visual inspection automation RV series, which can also be used for measurement
- For improving the efficiency of the entire plant Achieving the efficiency of the entire factory through system linkage
SPECIFICATIONS:
| RV-2-3DH（AOI/SPI） | ||
|---|---|---|
| Board size | 50mm×50mm-410mm×300mm 50mm×50mm-630mm×300mm (action to long board)*1 | |
| Test resolution | 12μm (standard resolution)/5μm (high resolution)*1 | |
| Image angle | 48.0×36.0mm、20.0×15.0mm*1 | |
| Inspection items | Shorting, shear, polarity, side-reverse, unsoldered solder, bridge, solder quantity, insertion part omission, character recognition*1 | |
| FOV (Optimum condition) | 2D | 0.2sec/1 screen |
| 3D | 61.8cm²/sec | |
| RV-2-3DHL（AOI/SPI） | ||
|---|---|---|
| Board size | Standard: 50mm×50mm-410mm×590mm Long board: 50mm×50mm-650mm×590mm*1 Marking unit: 50mm×50mm-330mm×590mm | |
| Test resolution | 12 μm (standard resolution) / 5 μm (high resolution)*1 | |
| Image angle | 48.0×36.0mm, 20.0×15.0mm*1 | |
| Inspection items | Shorting, shear, polarity, side-reverse, unsoldered solder, bridge, solder quantity, insertion part omission, character recognition*1 | |
| Inspection speed (Optimum condition) | ||
| 3D | 61.8cm²/sec | |