VisionPro AP Series
- Category: SPI Equipment
- Manufacturer: ASC
VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes training, an operator can perform accurate 3D measurements of solder paste pads, BGA’s and many other PCB features. VisionPro AP500’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability
About the VisionPro AP Series
Key Features & Benefits- Multiple Sensor Options: SP3D & PSI
- Automated Height, Area,Volume, Offset
- Gerber Programming & Auto-Scripting
- Defect Error Review
- Built-in Data and SPC Charting
- Color 3D Profiles of Measured Features
- ASCan Ultra Measurement Software
- Dell® PC and Windows® 7 /10 OS
- 20″ x 20″ Board Support
- 12″ x 20″ Max Board Inspection Area
- NIST Traceable Standard
- Hardware/Software Reference and Online Help
| Specifications | |
|---|---|
| Inspection Speed | .33 Sec./FOV |
| Height Accuracy | 1µm (0.04 mils) |
| Gauge R&R | <<10% (+/- 40% Tolerance) |
| Z Resolution | .48 µm (.019 mils) |
| Lateral Resolution (X-Y) | 6.8µm (.27 mils) |
| Minimum Paste Deposit | 51µm (2 mils) |