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MS-11e 3D SPI Equipment

  • High Speed Precision In-Line SPI Equipment System
  • Exclusive FIFTEEN MEGA PIXEL ISIS® Vision System.
  • 10 Micron / Pixel Precision TELECENTRIC COMPOUND LENS Design 
  • Advanced Dual Projection SHADOW FREE MOIRÉ Design
  • 2 Micron Height Accuracy
  • Precision AC Servo Drive Motor System
  • Extremely Simple Programming and Operation SPI Equipment

Description

About the MS-11e 3D SPI Equipment

  • Exclusive 15MP / 25MP CoaXPress SPI Equipment Camera System
  • Dual Projection Shadow Free Moiré Technology
  • Precision Compound Telecentric Camera Lens
  • Automated Z-Height Calibration System
  • Automated PCB Under Board Support System
  • Precision PCB Warpage Compensation
  • Closed Loop Communication With Screen Printer
  • Absolute Repeatability and Reproducibility
  • INTELLISYS® Industry 4.0 Intelligent Factory Automation System

MS-11e 3D SPI Equipment Quick contact

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