Semi-Automatic PCB Rework Station – Summit 1800i
- Category: PCB Rework Stations
- Manufacturer: VJ Electronix
High Precision, Semi-Automatic PCB Rework System For Medium-Sized SMD Assemblies
The most installed rework system in the world. The Summit 1800i is capable of handling boards up to 22″x30” and components as small as 01005.
About the Semi-Automatic PCB Rework Station – Summit 1800i
Built with easy-to-use 1-2-3-GO software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a repeatable rework process. Automatic non-contact site scavenging safely removes residual solder, eliminating potential for damage to pads and solder mask. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE systems.
Auto Profiling Capability - Fast and easy profile creation. Simply enter the desired product temperatures. After thermal profile is created, the entire reflow process is built automatically and ready to run.
Nitrogen Inert Environment - Programmable process control applies nitrogen only when needed maximizing N2 savings
Comprehensive Tooling - Wide range of tooling available to meet your current and future rework needs.
Efficient Convection Heating - Closed-loop temperature control ensures a more even heat distribution as compared to IR heating.
Independent Pick and Place - Motorized reflow head driven by an advanced motion system with programmable force control provides precision with total flexibility.
Non-Contact Site Scavenging - Dynamic height sensing control of distance between the scavenger tip and PCB (scavenger gap).
Industry 4.0 Compliant - Automated data/event logging directly to your EMS. Enhanced profile sharing and user collaboration.
Easy-To-Use Auto Profiling Software
- User-friendly, simple thermal profile development
- Default reflow profiles for standard rework processes
- Advanced profile analysis software confirms successful profile development
- Automatic reflow, remove, and replace profile created after development of Auto Profile Simple Component-to-Site Alignment
Simple Component-to-Site Alignment
- Two-color LED optical alignment system allows for easy-to-see component to site alignment
- Motorized and programmable Theta axis minimizes operator intervention
- Motorized and programmable X-Y table (option) for fully automated rework
Repeatable Thermal Performance
- Efficient Convection Heaters provide high thermal uniformity
- Board conditioning (preheat) is temperature based via thermocouples allowing for precise temperature measurements
Automatic Non-Contact Site Scavenging
- Dynamic Height Sensing (DHS) Scavenger maintains consistent scavenger tip to board gap safely removing residual solder
- Programmable X,Y, and Z axis eliminates operator intervention
- Nitrogen capability for consistent results without post scavenge cleaning
MES Interface
- Track all operations performed on rework system from automatic event log
- Reflow processes easily transferred between systems
Available Tooling for Any Surface Mount Component
- Standard nozzles for conventional components
- Special nozzles for unique components
Specifications
- Placement Capability: 0.0005” (12u) mean + 3σ
- Maximum Board Size: 455 x 560mm (560 x 760mm optional)
- Minimum Component Size: 01005
- Maximum Field of View: 65mm Square (80mm square optional)
- Thermocouple Jacks: 6 (14 optional)
- Theta Motion: 360°
- Top Heater: 2.2kW
- Area Heater: 4000W (7800W optional)
- Site Heater (optional): 1000W