Semi-Automatic Large PCB Rework Station – Summit LXi

About the Semi-Automatic Large PCB Rework Station – Summit LXi

Unlike other large board systems that are adapted versions of standard systems, the Summit LXi platform is the only rework system designed from the ground up to rework large boards. The LXi's new enhanced control system eliminates the affects of facility variations and supports more precise calibration, allowing process parameters to be readily shared between systems in multiple locations.

Despite the miniaturization achieved with Surface Mount Technology, increased signal speeds and funtionality require more and more circuitry to be assembled in close proximity. The net result is that many components and PCBs have grown larger and heavier. To satisfy the Rework requirements of these assemblies, VJ Electronix offers the Summit LXi Large Board Automated Rework System.

The Summit LXi is furnished with an X–Y table and Board Holder that can accommodate a PCB up to 24" x 36" (610mm x 915mm) and a 8kW Convection Plenum Bottom Heater for maximum heat transfer. Increased Top Side and Bottom Side Clearances, 2.75" (70mm) and 2.0" (51mm) respectively, and an optical system with an 80mm square Field of View allow very large components to be handled with ease.

All of the well established unique features such as Advanced Auto Profile, Programmable Pick and Place Force with Component Height Sensing, Independent Top Heater and Pick-up Tube, Proprietary Split Imaging together with Precision Placement capability, Optical/Digital Zoom, and Automated Data/Event Logging are included.

A variety of optional features such as a High Power (2.4 kW) Top Heater, a Local (Spot) Bottom Heater, Automatic Solder Scavenging, and a extra high power 10 kW Bottom Heater are available to handle the most challenging applications.

Built with easy-to-use 1-2-3-GO software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a repeatable rework process. Automatic non-contact site scavenging safely removes residual solder, eliminating potential for damage to pads and solder mask. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE systems.

Large Board Rework - Up to 1.2m board size. The only rework system designed specifically for large boards (not adapted).

Auto Profiling Capability - Fast and easy profile creation. Simply enter the desired product temperatures. After thermal profile is created, the entire reflow process is built automatically and ready to run.

Nitrogen Inert Environment - Programmable process control applies nitrogen only when needed maximizing N2 savings

Comprehensive Tooling - Wide range of tooling available to meet your current and future rework needs.

Efficient Convection Heating - Closed-loop temperature control ensures a more even heat distribution as compared to IR heating.

Independent Pick and Place - Motorized reflow head driven by an advanced motion system with programmable force control provides precision with total flexibility.

Non-Contact Site Scavenging - Dynamic height sensing control of distance between the scavenger tip and PCB (scavenger gap).

Industry 4.0 Compliant - Automated data/event logging directly to your EMS. Enhanced profile sharing and user collaboration.

Easy-To-Use Auto Profiling Software

• User-friendly, simple thermal profile development
• Default reflow profiles for standard rework processes
• Advanced profile analysis software confirms successful profile development
• Automatic reflow, remove, and replace profile created after development of Auto Profile Simple Component-to-Site Alignment

Simple Component-to-Site Alignment

• Two-color LED optical alignment system allows for easy-to-see component to site alignment
• Motorized and programmable Theta axis minimizes operator intervention
• Motorized and programmable X-Y table (option) for fully automated rework

Repeatable Thermal Performance

• Efficient Convection Heaters provide high thermal uniformity
• Board conditioning (preheat) is temperature based via thermocouples allowing for precise temperature measurements

Automatic Non-Contact Site Scavenging

• Dynamic Height Sensing (DHS) Scavenger maintains consistent scavenger tip to board gap safely removing residual solder
• Programmable X,Y, and Z axis eliminates operator intervention
• Nitrogen capability for consistent results without post scavenge cleaning

MES Interface

• Track all operations performed on rework system from automatic event log
• Reflow processes easily transferred between systems

Available Tooling for Any Surface Mount Component

• Standard nozzles for conventional components
• Special nozzles for unique components

Specifications

• Placement Capability: 0.0010” (25u) mean + 3σ
• Maximum Board Size: 600 x 900mm (650 x 1200mm optional)
• Minimum Component Size: 01005
• Maximum Field of View: 65mm Square (80mm square optional)
• Thermocouple Jacks: 6 (14 optional)
• Theta Motion: 360°
• Top Heater: 2200W
• Area Heater: 8000W (10000W optional)
• Site Heater (optional): 1000W