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Selective Wave Soldering Machine – Unit-i4

A New Generation Of Selective Wave Soldering

Highest output, highest ROI, highest flexibility, compact inline system. Unit-i4 combines a drop jet fluxer nozzle, bottom IR preheating, selective solder pot and AOI Function. The result is a full-function station for fluxing, preheating, soldering, and inspection.

Description

About the Selective Wave Soldering Machine – Unit-i4

  • 2 drop jet fluxers
  • Bottom IR preheating
  • 2 solder pots in two individual wave tunnels, each with two wave tunnels
  • The PCB is moved by a conveyor, the conveyor table moves in X/Y, the solder pot/fluxer movies in Z
  • Windows 10 system
  • 3-axis full servo drive with ball screw movement
  • Standard equipped with wave height calibration
  • Real-time soldering process monitor

Specifications

ItemUnit-i4
General
Operating power/Max power6KW/22KW
Machine dimension1300(L)*1840(W)*1200(H)
Net weight700KG
Power supply3PH 380V 50HZ
Air supply3-5 bars
Exhausting required800M3/h
PCYes
Typical Program Time10 Minutes
Conveyor
PCB dimensionW50xL50---W508xL508mm(single nozzle soldering) W50xL50---W508xL250mm(two nozzle soldering parally) W50xL50---W250xL250mm(four nozzles soldering parally)
PCB ClearanceTop 95mm bottom 30mm
PCB WeightMax 5kg
Conveyor widthAuto
Conveyor assembling motionX,Y motion with server motor/driver
PCB Robotic Platform
Flux Nozzle TypeDrop jet fluxer
Flux Nozzle Quantity2
Flux Tank Capacity1L
Flux Tank Quantity2
Flux Nozzle Distanceadjustable
Preheat
Preheating methodBottom IR heater
Solder Management
Solder pot typemechanical pump
Standard Solder Stations2
Solder Pot Capacity30 kgs
Solder Temperature ControlPID
Heat-UpTimeAbout 30mins
Max Temperature350°C
Wave tunnel4pcs (2pcs per solder pot)
Mini Wave NozzlesDia 3to12mm
Customized nozzleAvailable
Axes of MotionZ1, Z2
(N2) Inertion Management
N2 Consumption per Nozzle6--8m3/H
Required N2 Purity>99.99%

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