Entry Level Selective Soldering System | JUKI CUBE.460

About the Entry Level Selective Soldering System | JUKI CUBE.460

The CUBE.460 sets the new standard for mini-wave soldering systems. The unique batch platform offers excellent flexibility for through-hole applications. The CUBE.460 can be configured with a single nozzle or dual nozzle for increased flexibility. It supports an easy-to-use exchangeable solder pot for dual alloys. The CUBE.460 comes equipped with many standard features that include heated nitrogen at the soldering nozzle, 0° and 7° soldering to accommodate various types of nozzles including wetted nozzle tips and non-wetted nozzles, a live viewing camera, and fast-reacting Quartz IR bottom side preheater to name a few.

Accessibility to the CUBE.460 is very simple allowing for easy setup and easy maintenance. The solder pot and nozzles are ready for lead-free production. Changing the solder pot for use with a different alloy is made simple with the easy to use trolley system. A wide range of standard nozzles, special nozzles as well as an eight inch chip turbulent wave are available for this machine giving it the same flexibility as the previous JUKI machines.

The flexible programming software is identical whether you are programming on the machine during production or on an off-line programming location. This makes programming easy and simple.

STANDARD FEATURES

• 100 lb Pb free ready solder pot
• Heated Nitrogen at the soldering nozzle
• Large maximum board size up to 460mm x 460mm (18" x 18")
• 0° or 7° solder angle
• Built shuttle loading system to maintain constant production
• Fast reacting Quartz IR bottom side pre-heater
• Live process viewing camera
• Micro-Dot Drop-Jet fluxing system with 5 liter pressurized flux container
• Off-line programming s/w
• Packaged in a small footprint of 1430mm x 1550mm x 1250mm (56" x 61" x 49")

OPTIONS:

• Dual nozzles
• Additional solder pot for multiple alloys
• Wave height monitor
• Closed loop solder wire replenishing system
• 8" chip wave
• Specialty nozzles
• Top side maintenance/pre-heat
• Electromagnetic solder pot/pump assembly

SPECIFICATIONS:

• Dimensions with Shuttle: L2000mm W1550mm H1250mm (78.7" x 61" x 49.2")
• Weight: Approx. 800 kg (1760 lbs)
• Board Size
  • Min. 20mm x 20mm (0.79" x 0.79")
  • Max. 460mm x 460mm (18" x 18")
• Flux Head: Micro-Dot Drop-Jet (Spray Fluxer Optional)
• Pre-heat
  • Power: 4kW
  • Type: Bottom Side - Quartz IR emitters
  • Top Side Maintenance/Pre-heater: Built in over the PCB (Optional)