February 5, 2021 / Finetech
Diverse And Reliable Assembly Processes in Development And Production
Finetech’s FINEPLACER® pico ma is a true laboratory die bonder with the virtues of a production system. A virtually unlimited...
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August 20, 2019 / Finetech
With Sub Micron Accuracy from Lab to Fab
Finetech's high-precision placement and assembly systems support customers from the photonics and optoelectronics industry in cost-efficient product development and transfer...
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May 10, 2017 / Finetech
FINEPLACER® femto 2 – Automatic Sub Micron Bonder for Product Development and Production
FINEPLACER® femto 2 features a placement accuracy of up to ± 0.5 µm @ 3 Sigma and supports a wide...
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