Stencil And Misprinted Board Cleaner – KYZEN E5611
- Category: Stencil Cleaning Agents & Chemistries
- Manufacturer: Kyzen
A concentrated aqueous cleaning chemistry designed to remove non-reflowed solder paste and uncured chip bonder adhesives from stencils and hardware following the printing process. E5611 works on a wide range of solder paste technologies, including water soluble, rosin, low residue and synthetic flux compositions. Also effective at removing uncured SMT adhesives used to hold passive components prior to soldering.
- Works great at ambient temperatures
- Designed for spray-in-air and ultrasonic systems
- Compatible with standard stencil cleaning equipment
About the Stencil And Misprinted Board Cleaner – KYZEN E5611
KYZEN E5611 is designed for use in aqueous spray-in-air and ultrasonic stencil cleaning machines and is effective at low concentrations and ambient temperature. E5611 is uniquely designed to allow the product to be applied without rinsing however, rinsing with DI water following the cleaning process is recommended. The wash concentration of KYZEN E5611 depends on the soil type and levels of solvency needed to dissolve resin binder present in flux and adhesive compositions.
Product Data
- Application: Stencil Cleaner
- Process: Spray & Ultrasonic
- Concentration: <25%
- Temperature: Ambient to 120°F/49°C
- Rinse: Recommended DI Water
- Dry: Hot Air
- pH: N/A (Solvent-Based)
- Flash Point: None to Boiling
- Boiling Point: 217°F / 103°C
- Water Soluble: Partial
- VOC, @ 10% 83.2 g/L